8422.40.91.81/Semiconductor Gel-Pak Lid Sealer/Japan

Semiconductor Gel-Pak Lid Sealer from Japan

Precision sealer for Gel-Pak trays used in delicate die pick-and-place operations. Classified HTS 8422.40.91.81 as other sealing machinery for semiconductor dicing pucks. Uses controlled pressure to protect embedded dice.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify gel material biocompatibility; provide vacuum seal test protocols; document particle generation class