Semiconductor Gel-Pak Lid Sealer from Japan
Precision sealer for Gel-Pak trays used in delicate die pick-and-place operations. Classified HTS 8422.40.91.81 as other sealing machinery for semiconductor dicing pucks. Uses controlled pressure to protect embedded dice.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify gel material biocompatibility; provide vacuum seal test protocols; document particle generation class