Semiconductor Chip Tray Labeling Machine from Japan
High-precision labeling equipment that applies static-dissipative labels to trays holding semiconductor chips or dice. Falls under HTS 8422.40.91.81 as other labeling machinery for semiconductor packaging. Features vision systems for accurate placement in ESD-controlled environments.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify ESD-safe materials per ANSI/ESD S20.20; provide label adhesion test results for customs validation; avoid bulk import without serial numbers to prevent undervaluation claims