8422.40.91.81/Semiconductor Chip Tray Labeling Machine/Japan

Semiconductor Chip Tray Labeling Machine from Japan

High-precision labeling equipment that applies static-dissipative labels to trays holding semiconductor chips or dice. Falls under HTS 8422.40.91.81 as other labeling machinery for semiconductor packaging. Features vision systems for accurate placement in ESD-controlled environments.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify ESD-safe materials per ANSI/ESD S20.20; provide label adhesion test results for customs validation; avoid bulk import without serial numbers to prevent undervaluation claims