Die Attach Film Automated Packer from Japan
Machinery that cuts, stacks, and packs die attach film rolls into moisture-barrier bags for semiconductor assembly. HTS 8422.40.91.81 classification for other packing machinery serving the semiconductor supply chain. Features humidity-controlled dispensing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify film thickness tolerances in documentation; include desiccant integration details; ensure MSL (moisture sensitivity level) compliance data