Die Attach Film Automated Packer from Japan
Machinery that cuts, stacks, and packs die attach film rolls into moisture-barrier bags for semiconductor assembly. HTS 8422.40.91.81 classification for other packing machinery serving the semiconductor supply chain. Features humidity-controlled dispensing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify film thickness tolerances in documentation; include desiccant integration details; ensure MSL (moisture sensitivity level) compliance data