Die Attach Film Automated Packer from Japan
Machinery that cuts, stacks, and packs die attach film rolls into moisture-barrier bags for semiconductor assembly. HTS 8422.40.91.81 classification for other packing machinery serving the semiconductor supply chain. Features humidity-controlled dispensing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify film thickness tolerances in documentation; include desiccant integration details; ensure MSL (moisture sensitivity level) compliance data