Wafer Slicing Saw Protective Film Wrapper from Japan
Automated film wrapping machine for packaging wafer slicing saws used in semiconductor wafer preparation from crystal boules. Falls under HTS 8422.40.91.70 as other packing/wrapping machinery for semiconductor processing tools. Ensures blade and frame protection during international shipment to fabs.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide saw blade material safety data sheets with import documentation to address hazardous material concerns
• Confirm wrapper throughput matches semiconductor cleanroom shipping volumes for proper classification
• Include vibration testing certifications showing suitability for delicate diamond wire saw transport