Wafer Slicing Saw Protective Film Wrapper from China
Automated film wrapping machine for packaging wafer slicing saws used in semiconductor wafer preparation from crystal boules. Falls under HTS 8422.40.91.70 as other packing/wrapping machinery for semiconductor processing tools. Ensures blade and frame protection during international shipment to fabs.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide saw blade material safety data sheets with import documentation to address hazardous material concerns
• Confirm wrapper throughput matches semiconductor cleanroom shipping volumes for proper classification
• Include vibration testing certifications showing suitability for delicate diamond wire saw transport