8422.40.91.70/Wafer Grinder Protective Wrap Station/Japan

Wafer Grinder Protective Wrap Station from Japan

Stationary wrapping station for wafer grinders bringing semiconductor wafers to dimensional tolerances. Falls under HTS 8422.40.91.70 for specialized semiconductor equipment wrapping. Ensures contamination-free transport to wafer fabs.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document tolerance specifications (microns) achieved by wrapped grinders

• Ensure ESD-safe wrapping materials for static-sensitive equipment

• Comply with semiconductor equipment export licensing requirements