Semiconductor Wafer Prep Equipment Pallet Wrapper from Japan
Pallet stretch wrapping machine for complete semiconductor wafer preparation equipment sets. Under HTS 8422.40.91.70 as other wrapping machinery for semiconductor processing tools. Secures grinders, lappers, and polishers for fab installation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• List all wafer prep equipment models being wrapped in commercial invoice
• Ensure pallet wrapper load capacity matches semiconductor tool weights
• Include fab installation protocols showing transport requirements