Semiconductor Wafer Slurry Filtration Housing from Japan
A filtration apparatus part designed for purifying abrasive slurries used in wafer slicing saws during semiconductor wafer preparation from crystal boules. Classified under HTS 8421.99.0180 as a filtering machinery part for liquids in semiconductor processing. It removes contaminants to prevent defects in sliced wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include process flow diagrams showing slurry use in wafer slicing to confirm semiconductor-specific classification
• Label with material compatibility for silicon carbide slurries and pressure ratings for compliance