Semiconductor Wafer Slurry Filtration Housing from Japan
A filtration apparatus part designed for purifying abrasive slurries used in wafer slicing saws during semiconductor wafer preparation from crystal boules. Classified under HTS 8421.99.0180 as a filtering machinery part for liquids in semiconductor processing. It removes contaminants to prevent defects in sliced wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include process flow diagrams showing slurry use in wafer slicing to confirm semiconductor-specific classification
• Label with material compatibility for silicon carbide slurries and pressure ratings for compliance