Semiconductor Wafer Slurry Filtration Housing from China
A filtration apparatus part designed for purifying abrasive slurries used in wafer slicing saws during semiconductor wafer preparation from crystal boules. Classified under HTS 8421.99.0180 as a filtering machinery part for liquids in semiconductor processing. It removes contaminants to prevent defects in sliced wafers.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include process flow diagrams showing slurry use in wafer slicing to confirm semiconductor-specific classification
• Label with material compatibility for silicon carbide slurries and pressure ratings for compliance