Gallium Arsenide Wafer Lapping Filter Assembly from Japan
Filter part for lapping machines that flatten semiconductor wafers sliced from GaAs boules, ensuring surface flatness for fabrication. Falls under HTS 8421.99.0180 per statistical notes for wafer preparation equipment (a)(ii)(C). Removes lapping debris for defect-free wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document compatibility with gallium arsenide materials to leverage statistical provisions
• Use manufacturer specs linking to wafer lappers/polishers in customs entry