Gallium Arsenide Wafer Lapping Filter Assembly from Japan
Filter part for lapping machines that flatten semiconductor wafers sliced from GaAs boules, ensuring surface flatness for fabrication. Falls under HTS 8421.99.0180 per statistical notes for wafer preparation equipment (a)(ii)(C). Removes lapping debris for defect-free wafers.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document compatibility with gallium arsenide materials to leverage statistical provisions
• Use manufacturer specs linking to wafer lappers/polishers in customs entry