Gallium Arsenide Wafer Lapping Filter Assembly from China
Filter part for lapping machines that flatten semiconductor wafers sliced from GaAs boules, ensuring surface flatness for fabrication. Falls under HTS 8421.99.0180 per statistical notes for wafer preparation equipment (a)(ii)(C). Removes lapping debris for defect-free wafers.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document compatibility with gallium arsenide materials to leverage statistical provisions
• Use manufacturer specs linking to wafer lappers/polishers in customs entry