Crystal Boule Slicing Saw Coolant Filter Module from Japan
Modular filter for coolant in wafer slicing saws cutting monocrystalline boules into semiconductor wafers per statistical note (a)(ii)(B). Under HTS 8421.99.0180 as liquid filtering parts for semiconductor processing. Captures diamond grit and silicon particles.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include saw blade specs and coolant diamond slurry composition in filings
• Reference statistical note wafer slicing equipment explicitly
• Ensure no bulk packaging that suggests general industrial filter use