Wafer Slicing Saw Coolant Filtration Unit from Japan
Liquid filtering system for diamond wire saw coolants during wafer slicing from semiconductor boules, preventing thermal damage. Classified HTS 8421.29.0065 for other purifying apparatus in wafer manufacturing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond wire saw compatibility and kerf loss minimization features
• Wafer thickness tolerance data links filtration to semiconductor quality