Wafer Lapping Slurry Centrifugal Separator from Japan
Centrifugal separator for recycling and purifying lapping slurries in semiconductor wafer preparation, ensuring flatness for fabrication. Classified under HTS 8421.29.0065 as other filtering machinery for semiconductor liquid processing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit slurry recycling efficiency data and wafer flatness tolerance correlations
• Use semiconductor statistical note references in entry documentation