Semiconductor Wafer Slurry Filtration System from Japan
High-precision filtering machinery for purifying chemical slurries used in wafer slicing and polishing during semiconductor production. It removes contaminants from liquid slurries under HTS 8421.29.0065 as other apparatus for liquids in chip fabrication processes.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document slurry composition (e.g
• silica, chemicals) and micron filtration levels for customs verification
• Certify cleanroom compatibility (ISO class) to prove semiconductor end-use