8421.19.00.00/Silicon Ingot Centrifugal Polisher/Japan

Silicon Ingot Centrifugal Polisher from Japan

Rotating centrifugal polisher that processes silicon ingots to precise surface flatness before wafer slicing in semiconductor fabrication. Falls under HTS 8421.19.00.00 as specialized other centrifuges for wafer manufacturing preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document flatness specs (<1 micron deviation) matching statistical note requirements; provide evidence of semiconductor-only use; ensure vibration isolation ratings for cleanroom import