Precision Wafer Lapping Centrifuge from Japan
Centrifugal lapping machine that rotates semiconductor wafers against abrasive surfaces to achieve critical flatness for device fabrication. HTS 8421.19.00.00 includes this wafer preparation equipment.
Duty Rate — Japan → United States
11.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include total thickness variation (TTV) specs (<0.5μm); document lapping plate materials (cast iron/copper); ensure endpoint detection system description