8421.19.00.00/Precision Wafer Lapping Centrifuge/Japan

Precision Wafer Lapping Centrifuge from Japan

Centrifugal lapping machine that rotates semiconductor wafers against abrasive surfaces to achieve critical flatness for device fabrication. HTS 8421.19.00.00 includes this wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include total thickness variation (TTV) specs (<0.5μm); document lapping plate materials (cast iron/copper); ensure endpoint detection system description