Precision Wafer Lapping Centrifuge from China
Centrifugal lapping machine that rotates semiconductor wafers against abrasive surfaces to achieve critical flatness for device fabrication. HTS 8421.19.00.00 includes this wafer preparation equipment.
Duty Rate — China → United States
38.8%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include total thickness variation (TTV) specs (<0.5μm); document lapping plate materials (cast iron/copper); ensure endpoint detection system description