Compound Semiconductor Slurry Centrifuge from Japan
Centrifuge separating polishing slurry from gallium arsenide or silicon wafers post-chemical mechanical planarization in semiconductor fabs. Classified under 8421.19.00.00 for other centrifuges in wafer processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify particle size separation (sub-micron) and chemical compatibility; provide fab wastewater handling certification; avoid general water treatment centrifuge classification