Centrifugal Wafer Edge Profiling Machine from Japan
Specialized centrifuge that rotates wafers to profile and bevel edges for fracture prevention during semiconductor processing. HTS 8421.19.00.00 covers this as other centrifuge for wafer preparation per statistical notes.
Duty Rate — Japan → United States
11.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge bevel angles (45°) and wafer thickness range (50-775μm); provide SEMI standards compliance; distinguish from general glass edging equipment