Centrifugal Wafer Edge Profiling Machine from China
Specialized centrifuge that rotates wafers to profile and bevel edges for fracture prevention during semiconductor processing. HTS 8421.19.00.00 covers this as other centrifuge for wafer preparation per statistical notes.
Duty Rate — China → United States
38.8%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify edge bevel angles (45°) and wafer thickness range (50-775μm); provide SEMI standards compliance; distinguish from general glass edging equipment