8421.19.00.00/Centrifugal Wafer Edge Profiling Machine/Canada

Centrifugal Wafer Edge Profiling Machine from Canada

Specialized centrifuge that rotates wafers to profile and bevel edges for fracture prevention during semiconductor processing. HTS 8421.19.00.00 covers this as other centrifuge for wafer preparation per statistical notes.

Duty Rate — Canada → United States

11.3%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify edge bevel angles (45°) and wafer thickness range (50-775μm); provide SEMI standards compliance; distinguish from general glass edging equipment

Centrifugal Wafer Edge Profiling Machine from Canada — Import Duty Rate | HTS 8421.19.00.00