Wafer Slicing Saw Cooling Pump Module from Japan
Integrated cooling pump assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Provides temperature-controlled coolant circulation to maintain blade precision during high-speed slicing. Classified as a part of 8419 temperature treatment machinery for semiconductor wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include saw compatibility specs and coolant flow rate data; ensure pressure vessel certifications if applicable; common pitfall is misclassifying as general saw parts