Semiconductor Wafer Polisher Heating Mantle from Japan
Flexible heating mantle for maintaining polishing slurry temperature in chemical mechanical planarization (CMP) equipment for semiconductor wafers. Ensures uniform chemical reaction rates across wafer surface. Part of 8419.90.95.80 temperature processing machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare maximum operating temperature and chemical resistance; provide uniformity specs; common error is classifying as lab heating equipment