Wafer Lapping Machine Coolant Circulator from Germany
Refrigerated circulator maintaining coolant at 15-20°C for wafer lapping and polishing equipment, ensuring flatness tolerances critical for semiconductor fabrication. Removes heat from grinding process. Under HTS 8418.99.8060 for wafer preparation equipment.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document integration with specific lapping tools (e.g
• Disco, Strasbaugh); provide flatness tolerance specs achieved
• Avoid generic pump classification