Wafer Prep Station Air Cooled Condensing Unit from Japan
Air-cooled condensing unit for multi-function wafer preparation stations encompassing grinding, slicing, and polishing AC systems. Classified HTS 8415.83.0060 as other heat exchangers for semiconductor manufacturing air conditioning without refrigerating units. Supports integrated prep for high-volume wafer production.
Duty Rate — Japan → United States
26.4%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Detail station functions (grind/slice/polish) matching statistical note (a)(ii)
• Use preferential tariff claims if from qualifying semiconductor hubs