Wafer Prep Station Air Cooled Condensing Unit from Canada
Air-cooled condensing unit for multi-function wafer preparation stations encompassing grinding, slicing, and polishing AC systems. Classified HTS 8415.83.0060 as other heat exchangers for semiconductor manufacturing air conditioning without refrigerating units. Supports integrated prep for high-volume wafer production.
Duty Rate — Canada → United States
26.4%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Detail station functions (grind/slice/polish) matching statistical note (a)(ii)
• Use preferential tariff claims if from qualifying semiconductor hubs