Wafer Grinder Air Conditioning Heat Exchanger from Japan
Heat exchanger for air conditioning systems in wafer grinding machines, controlling temperature and humidity during boule diameter precision grinding. Under HTS 8415.83.0060 as other heat exchangers for AC machines in semiconductor wafer preparation equipment. Critical for maintaining flatness and conductivity indicator flats on crystals.
Duty Rate — Japan → United States
26.4%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document linkage to wafer grinder's motor-driven fan for temperature/humidity change to fit AC machine definition
• Certify materials for cleanroom compatibility to prevent reclassification as general machinery parts