Silicon Wafer Slicing Saw Temperature Exchanger from China
Temperature control heat exchanger for air conditioning enclosures on wafer slicing saws from monocrystalline boules. Fits HTS 8415.83.0060 as other non-refrigerated AC heat exchangers in semiconductor wafer manufacturing apparatus. Prevents thermal distortion during precise slicing for optimal wafer yield.
Duty Rate — China → United States
36.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Submit blueprints illustrating fan-driven airflow and heat exchange for slicing saw integration
• Comply with cleanroom standards documentation to affirm semiconductor end-use