Vacuum Compressor Housing for Semiconductor Wafer Polishers from Japan
Lightweight composite/metal hybrid housing for vacuum compressors maintaining polishers that achieve mirror-finish flatness on semiconductor wafers prior to device fabrication. Covered by HTS 8414.90.41.65 statistical note (a)(ii)(C).
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document hybrid material composition and vacuum integrity test results
• Specify polishing tolerances achieved (angstrom-level flatness) linking to semiconductor use
• Avoid classification as general polishing machine parts (8469 series)