Titanium Compressor Housing for Semiconductor Wafer Lapping Machines from Japan
Corrosion-resistant titanium housing for air compressors supplying pressure to lapping/polishing equipment that achieves flatness tolerances on semiconductor wafers. Falls under HTS 8414.90.41.65 per statistical note (a)(ii)(C) for wafer preparation apparatus.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify titanium grade suitable for semiconductor cleanrooms (low particle generation)
• Link to specific lapping machine models in documentation for statistical note qualification