8414.90.41.65/Titanium Compressor Housing for Semiconductor Wafer Lapping Machines/Japan

Titanium Compressor Housing for Semiconductor Wafer Lapping Machines from Japan

Corrosion-resistant titanium housing for air compressors supplying pressure to lapping/polishing equipment that achieves flatness tolerances on semiconductor wafers. Falls under HTS 8414.90.41.65 per statistical note (a)(ii)(C) for wafer preparation apparatus.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify titanium grade suitable for semiconductor cleanrooms (low particle generation)

• Link to specific lapping machine models in documentation for statistical note qualification

Titanium Compressor Housing for Semiconductor Wafer Lapping Machines from Japan — Import Duty Rate | HTS 8414.90.41.65