Titanium Compressor Housing for Semiconductor Wafer Lapping Machines from Japan
Corrosion-resistant titanium housing for air compressors supplying pressure to lapping/polishing equipment that achieves flatness tolerances on semiconductor wafers. Falls under HTS 8414.90.41.65 per statistical note (a)(ii)(C) for wafer preparation apparatus.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Certify titanium grade suitable for semiconductor cleanrooms (low particle generation)
• Link to specific lapping machine models in documentation for statistical note qualification