Wafer Lapping Machine Slurry Compressor Head from Germany
Compressor head assembly for hermetic units that pressurize abrasive slurry in wafer lapping machines, achieving sub-micron flatness for semiconductor wafer surfaces before polishing. Critical for dimensional tolerance in wafer fabrication prep. Classified 8414.90.41.55 for 8414.40 compressor parts in semiconductor processing.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide surface flatness specs (e.g
• <1μm) tying to statistical note wafer preparation criteria
• Include slurry compatibility certification for chemical resistance