8414.90.41.55/Wafer Lapping Machine Slurry Compressor Head/Germany

Wafer Lapping Machine Slurry Compressor Head from Germany

Compressor head assembly for hermetic units that pressurize abrasive slurry in wafer lapping machines, achieving sub-micron flatness for semiconductor wafer surfaces before polishing. Critical for dimensional tolerance in wafer fabrication prep. Classified 8414.90.41.55 for 8414.40 compressor parts in semiconductor processing.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide surface flatness specs (e.g

• <1μm) tying to statistical note wafer preparation criteria

• Include slurry compatibility certification for chemical resistance

Wafer Lapping Machine Slurry Compressor Head from Germany — Import Duty Rate | HTS 8414.90.41.55