Wafer Lapping Machine Compressor Rotor from Japan
Rotor for compressors powering wafer lapping equipment that achieves critical flatness for semiconductor fabrication. Covered by HTS 8414.90.30.00 for 8414.30 compressor rotors in statistical note (b)(i)(C) wafer preparation.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify lapping tolerances (e.g
• <1 micron flatness) proving semiconductor use
• Anti-static certifications needed for cleanroom compatibility
• Avoid generic 'lapping machine part' descriptions triggering machine tool classification