Wafer Lapping Machine Compressor Rotor from Japan
Rotor for compressors powering wafer lapping equipment that achieves critical flatness for semiconductor fabrication. Covered by HTS 8414.90.30.00 for 8414.30 compressor rotors in statistical note (b)(i)(C) wafer preparation.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify lapping tolerances (e.g
• <1 micron flatness) proving semiconductor use
• Anti-static certifications needed for cleanroom compatibility
• Avoid generic 'lapping machine part' descriptions triggering machine tool classification