Wafer Slicing Saw Vacuum Compressor from China
High-precision compressor supplying vacuum hold-down for wafer slicing saws that cut monocrystalline boules into semiconductor wafers. Under HTS 8414.80.20 for other compressors in wafer preparation equipment per statistical notes. Critical for maintaining wafer flatness during diamond saw slicing operations.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit evidence linking compressor to wafer slicing from semiconductor boules; check for coolant system integration compliance
• Pitfall: failing to distinguish from general machine shop compressors