Wafer Lapping Machine Gas Compressor from Japan
Gas compressor for wafer lappers that achieve ultra-flat surfaces on semiconductor wafers prior to fabrication. Falls under HTS 8414.80.20 as other compressor for wafer preparation equipment in statistical notes. Controls slurry flow and vacuum chucks during lapping process.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide flatness tolerance data (e.g
• <1 micron) confirming semiconductor wafer standards; ensure cleanroom certification
• Pitfall: undervaluing as generic lapping equipment compressor