Wafer Lapping Machine Gas Compressor from Germany
Gas compressor for wafer lappers that achieve ultra-flat surfaces on semiconductor wafers prior to fabrication. Falls under HTS 8414.80.20 as other compressor for wafer preparation equipment in statistical notes. Controls slurry flow and vacuum chucks during lapping process.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide flatness tolerance data (e.g
• <1 micron) confirming semiconductor wafer standards; ensure cleanroom certification
• Pitfall: undervaluing as generic lapping equipment compressor