Wafer Lapping Vacuum Pump System from Japan
Rotary vacuum pump >746 kW for wafer lapping machines that extracts lapping slurry to achieve precise flatness tolerances required for semiconductor fabrication. Addresses statistical note (a)(ii)(C) wafer preparation equipment. Classified under 8414.80.20.75 as high-power other vacuum pump for semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Reference statistical note (a)(ii)(C) in commercial invoice for lapping/polishing application
• Provide flatness tolerance specs (e.g
• <1 micron) demonstrating semiconductor precision requirements
• Avoid parts classification by importing as complete functional pump units