Wafer Lapping Vacuum Pump System from China
Rotary vacuum pump >746 kW for wafer lapping machines that extracts lapping slurry to achieve precise flatness tolerances required for semiconductor fabrication. Addresses statistical note (a)(ii)(C) wafer preparation equipment. Classified under 8414.80.20.75 as high-power other vacuum pump for semiconductor processing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Reference statistical note (a)(ii)(C) in commercial invoice for lapping/polishing application
• Provide flatness tolerance specs (e.g
• <1 micron) demonstrating semiconductor precision requirements
• Avoid parts classification by importing as complete functional pump units