Semiconductor Wafer Slicing Saw Vacuum System from China
Integrated high-power vacuum pump (>746 kW) for wafer slicing saws that removes slurry and debris during diamond saw cutting of semiconductor boules into wafers. Ensures clean, precise wafer production per statistical note (a)(ii)(B). Classified as other vacuum pump under 8414.80.20.75 due to power rating and semiconductor processing function.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide saw specifications linking vacuum pump to wafer slicing per statistical note to prevent misclassification as general industrial pump
• Include safety certifications for high-power electrical systems required for semiconductor cleanroom import
• Document reciprocating or rotary pump type accurately for .20 subheading verification