Wafer Lapping Machine Air Compressor from Japan
Scroll compressor supplying precisely regulated air pressure to wafer lappers/polishers achieving semiconductor flatness specifications. HTS 8414.80.20.55 for this ≤186.5 kW compressor in wafer surface preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document flatness specs achieved (angstroms) to confirm semiconductor use
• Include vibration isolation specs for cleanroom mounting
• Certify oil-free operation for wafer surface contamination prevention