Wafer Lapping Machine Axial Vacuum Pump from Japan
Axial vacuum pump removing slurry and debris during the lapping process that achieves critical flatness on semiconductor wafers prior to fabrication. Classified in HTS 8414.80.20.15 as axial pumps for wafer preparation equipment listed in statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify lapping tolerances achieved (e.g
• <1 micron flatness); include slurry compatibility data; ensure ATEX certification if explosive atmospheres apply