8414.80.20.15/Wafer Lapping Machine Axial Vacuum Pump/Japan

Wafer Lapping Machine Axial Vacuum Pump from Japan

Axial vacuum pump removing slurry and debris during the lapping process that achieves critical flatness on semiconductor wafers prior to fabrication. Classified in HTS 8414.80.20.15 as axial pumps for wafer preparation equipment listed in statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify lapping tolerances achieved (e.g

• <1 micron flatness); include slurry compatibility data; ensure ATEX certification if explosive atmospheres apply