Semiconductor Wafer Slicing Saw Vacuum Pump from Japan
Centrifugal vacuum pump integrated with wafer slicing saws to evacuate cutting zones and coolant chambers during precise slicing of semiconductor wafers from crystal boules. HTS 8414.80.20.15 applies as centrifugal pumps for wafer preparation equipment noted in statistical definitions.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document compatibility with diamond wire or blade saws for semiconductor use; require cleanroom-grade certifications; avoid misclassification by specifying wafer dimensions handled (e.g
• 300mm)