Semiconductor Wafer Slicing Saw Vacuum Pump from China
Centrifugal vacuum pump integrated with wafer slicing saws to evacuate cutting zones and coolant chambers during precise slicing of semiconductor wafers from crystal boules. HTS 8414.80.20.15 applies as centrifugal pumps for wafer preparation equipment noted in statistical definitions.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document compatibility with diamond wire or blade saws for semiconductor use; require cleanroom-grade certifications; avoid misclassification by specifying wafer dimensions handled (e.g
• 300mm)