Semiconductor Crystal Slicer Gas Axial Compressor from Mexico
Axial compressor managing process gases during inner diameter (ID) saw slicing of semiconductor crystals into wafers. Statistical note (a)(ii)(B) wafer slicing saws; HTS 8414.80.20.15 classification.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify ID saw blade diameter accommodation; provide gas flow rate certifications; comply with blade safety standards