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8414.80.20.15/Semiconductor Crystal Slicer Gas Axial Compressor/Japan

Semiconductor Crystal Slicer Gas Axial Compressor from Japan

Axial compressor managing process gases during inner diameter (ID) saw slicing of semiconductor crystals into wafers. Statistical note (a)(ii)(B) wafer slicing saws; HTS 8414.80.20.15 classification.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify ID saw blade diameter accommodation; provide gas flow rate certifications; comply with blade safety standards