Semiconductor Crystal Slicer Gas Axial Compressor from Germany
Axial compressor managing process gases during inner diameter (ID) saw slicing of semiconductor crystals into wafers. Statistical note (a)(ii)(B) wafer slicing saws; HTS 8414.80.20.15 classification.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify ID saw blade diameter accommodation; provide gas flow rate certifications; comply with blade safety standards