Wafer Polishing Fume Containment Hood from Japan
Ventilating hood with downdraft fan for containing slurry mists during semiconductor wafer lapping and polishing, 105 cm max side. Features slotted work surface for airflow over wafers. Classified in 8414.60.00.00 for compact fan-equipped hoods.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide process flow diagrams showing semiconductor use; label with exact dimensions
• Avoid pitfalls by distinguishing from larger industrial exhaust systems