Wafer Polishing Fume Containment Hood from Japan
Ventilating hood with downdraft fan for containing slurry mists during semiconductor wafer lapping and polishing, 105 cm max side. Features slotted work surface for airflow over wafers. Classified in 8414.60.00.00 for compact fan-equipped hoods.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide process flow diagrams showing semiconductor use; label with exact dimensions
• Avoid pitfalls by distinguishing from larger industrial exhaust systems