Wafer Slicing Saw Vacuum Pump from China
Specialized vacuum pump for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, providing precise vacuum hold-down during high-speed diamond saw operations. It qualifies under HTS 8414.59.65.95 as other vacuum pumps for semiconductor wafer preparation equipment noted in statistical provisions. Ensures minimal material loss and flatness for subsequent processing.
Duty Rate — China → United States
39.8%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Submit blueprints showing integration with wafer saws to customs; ensure cleanroom compatibility certifications
• Avoid pitfall of general pump classification by highlighting semiconductor boule specificity