Monocrystalline Boule Slicer Fan from Japan
Dust extraction fan for wafer slicing saws cutting monocrystalline semiconductor boules, capturing diamond saw particulates in vacuum-assisted slicing. HTS 8414.59.65.95 for other fans in wafer slicing equipment under statistical definitions. Ensures clean wafers for lapping/polishing stages.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Demonstrate particle size capture (<0.1 micron) for cleanroom validation; silica dust hazard declarations
• Pitfall: HVAC classification ignores process specificity