Monocrystalline Boule Slicer Fan from Japan
Dust extraction fan for wafer slicing saws cutting monocrystalline semiconductor boules, capturing diamond saw particulates in vacuum-assisted slicing. HTS 8414.59.65.95 for other fans in wafer slicing equipment under statistical definitions. Ensures clean wafers for lapping/polishing stages.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Demonstrate particle size capture (<0.1 micron) for cleanroom validation; silica dust hazard declarations
• Pitfall: HVAC classification ignores process specificity