Compact Axial Fan for Inline Wafer Grinder from Germany
Compact axial fan integrated into inline wafer grinding stations processing multiple semiconductor wafers simultaneously. Provides spot cooling and chip evacuation. Falls under HTS 8414.59.65.90 other axial fans.
Duty Rate — Germany → United States
27.3%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Throughput capacity docs linking to multi-wafer processing rates
• Avoid 'computer fan' misclassification despite compact size